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  王慧颖博士

  王慧颖博士,辽宁省沈阳人,上海交通大学电子科学与技术专业,主要研究方向微电子封装及互联材料研究。

  一、论文发表

  [1] Wang H Y, P. Cheng, S. Wang, H. Wang, T. Gu, J. Li, et al., "Effect of thermal treatment on the mechanical properties of Cu specimen fabricated using electrodeposition bath for through-silicon-via filling," Microelectronic Engineering, vol. 114, pp. 85-90, 2014

  [2] Wang H Y, P. Cheng, H. Wang, R. Liu, L. Sun, Q. Rao, et al., "Effect of current density on microstructure and mechanical property of Cu micro-cylinders electrodeposited in through silicon vias," Materials Characterization, vol. 109, pp. 164-172, 2015.

  [3] Wang H Y, H. Wang, G. Ding, Z. Wang, R. Liu, and P. Cheng, "Microstructure and Hardness of Electrodeposited Cu Micro-cylinders in Through-silicon via by Direct Current Power," Micro & Nano Letters, vol. 11, 2016.

  [4] IEEE CPMT (Components, Packaging, and Manufacturing Technology) Symposium Japan 2013

  二、申请专利

  1.用于TSV铜互联材料力学性能测试的原位拉伸试样;汪红,王慧颖,丁桂甫,顾挺,李君翊,程萍;ZL 2012 1 0050952.5

  2.用于3D-TSV铜互连材料力学性能测试的原位拉伸试样;丁桂甫,王慧颖,程萍,汪红,戴旭涵,顾挺;ZL 2013 1 0471647.8

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